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product feature

1.manual and automatic integration design

2.360 degree symmetry structure,pressure protect,float BGA limited plate

3.Adopt medium frequency, ageing, function signal separate study, O/S testing environment

4,Use high-performance engineering material made, acceptable to test at -40 Celcius degree to +120

celcius degree environment

5.Use surface bearing rotate,save effort and no abrasion, fixed probe stroke meanwhile protect solder

ball shape

6.Use import probe, probe's crown shape be able to break oxide layer of solder ball surface, probe

surface plate gold,effective guarantee the stability of contact,and also protect probe shape,

working life achieve to 80 thousand ! and probe beable to replace, more easy maintenance.

7.Low cost, long working life , easy maintenance, stable performance

Product parameter

Product name        :BGA672 CPU test socket

Material            : AL6061 + Torlon + PEEK

Electric conductor  :POGO pin

Spring force        :30g/pin

Contact resistance  :30mΩ   MAX

Max current capacity:3A

Working temperature :-40 Celcius degree to + 120 Celcius degree

Working life        :80 thousand times

IC size             :31 x 31

IC pitch            :1.0

Pin count           :672